Interfacial diffusion and Kirkendall voids evolution in the Copper-Zinc alloy binary interface revealed by in situ transmission electron microscopy

Authors: Lilin Xie, Hui Lu, Yilin Jiao, Shihang Qiao, Yisheng Zheng, Ang Li, Yanhui Chen, Xiaodong Han

Journal: Journal of Alloys and Compounds · Impact Factor: 6.371

DOI: https://doi.org/10.1016/j.jallcom.2023.172018