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Semiconductors & Failure Analysis

Watch devices switch, degrade and fail while they operate. At atomic resolution, under live biasing, heating and cooling.

Probe device physics under live operating conditions

Semiconductor devices are becoming increasingly complex as technology nodes continue to shrink and new materials are introduced for advanced logic, memory, power electronics and optoelectronic devices. Understanding electrical behavior, interface evolution, defect formation and failure mechanisms at the nanoscale is therefore essential for improving device performance, reliability and manufacturing yield.

DENSsolutions platforms let researchers combine electrical biasing, heating, cooling and advanced analytical techniques inside the electron microscope, so semiconductor devices can be investigated under realistic operating conditions. From resistive switching and phase-change memory to ferroelectric devices, wide-bandgap semiconductors, EBIC imaging and advanced failure analysis, these capabilities give direct insight into the dynamic behavior of semiconductor devices and functional materials.

Advance your semiconductor and failure analysis research

Talk to our application specialists to find the right in situ TEM platform for your experiments.

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